Stress Induced Voiding & Electromigration Analysis of Cu-Cu bonds

Stress Induced Voiding & Electromigration Analysis of Cu-Cu bonds

EnglishPaperback / softback
Singh, Dr Harjinder
LAP Lambert Academic Publishing
EAN: 9786139858248
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EAN 9786139858248
ISBN 6139858240
Binding Paperback / softback
Publisher LAP Lambert Academic Publishing
Publication date June 19, 2018
Pages 60
Language English
Dimensions 229 x 152 x 4
Readership General
Authors Sappal, Dr Amandeep Singh; Sharma, Manvinder; Singh, Dr Harjinder