Signal Processing, Telecommunication and Embedded Systems with  AI and ML Applications

Signal Processing, Telecommunication and Embedded Systems with AI and ML Applications

EnglishHardback
Springer Verlag, Singapore
EAN: 9789819784219
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Detailed information

The book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics, and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2023), organized by Department of Electronics and Communication Engineering, National Institute of Technology Mizoram, India during 6 – 7 October 2023. The book is divided into two volumes, and it covers papers written by scientists, research scholars and practitioners from leading universities, engineering colleges and R&D

institutes from all over the world and share the latest breakthroughs in and promising solutions to the most important issues facing today’s society.

EAN 9789819784219
ISBN 9819784212
Binding Hardback
Publisher Springer Verlag, Singapore
Publication date January 25, 2025
Pages 432
Language English
Dimensions 235 x 155
Country Singapore
Illustrations VI, 432 p. 216 illus., 182 illus. in color.
Editors Anguera, Jaume; Bhateja Vikrant; Chakravarthy, V. V. S. S. S; Flores Fuentes, Wendy; Ghosh, Anumoy
Edition 2024 ed.
Series Lecture Notes in Electrical Engineering