Through Silicon Vias

Through Silicon Vias

AngličtinaEbook
Kaushik, Brajesh Kumar
Taylor & Francis Ltd
EAN: 9781315351797
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Podrobné informace

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.

EAN 9781315351797
ISBN 131535179X
Typ produktu Ebook
Vydavatel Taylor & Francis Ltd
Datum vydání 30. listopadu 2016
Stránky 232
Jazyk English
Země United Kingdom
Autoři Alam, Arsalan; Kaushik, Brajesh Kumar; Majumder, Manoj Kumar; Ramesh Kumar, Vobulapuram