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Author: Lau, John
Heterogeneous Integrations

Heterogeneous Integrations

John H. Lau, Lau
EnglishPaperbackPrint on demand
Springer Nature B.V.
ISBN: 9789811372254
Print on demand
Delivery on Monday, 2. of December 2024
Print on demand
Delivery on Monday, 2. of December 2024
CZK 1,372 -10%
Reliability of RoHS-Compliant 2D and 3D IC Interconnects

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

Lau John
EnglishHardbackPrint on demand
McGraw-Hill Education - Europe
ISBN: 9780071753791
Print on demand
Delivery on Thursday, 21. of November 2024
Print on demand
Delivery on Thursday, 21. of November 2024
CZK 4,705 -10%
3D IC Integration and Packaging

3D IC Integration and Packaging

Lau John
EnglishHardbackPrint on demand
McGraw-Hill Education - Europe
ISBN: 9780071848060
Print on demand
Delivery on Thursday, 21. of November 2024
Print on demand
Delivery on Thursday, 21. of November 2024
CZK 6,360 -10%
Basics Fashion Design 09: Designing Accessories

Basics Fashion Design 09: Designing Accessories

Lau, John
EnglishPaperback / softback
Bloomsbury Publishing PLC
ISBN: 9781350108851
On order
Delivery on Friday, 22. of November 2024
On order
Delivery on Friday, 22. of November 2024
CZK 700 -10%
Diseño de accesorios

Diseño de accesorios

Lau, John
SpanishPaperback / softback
GUSTAVO GILI
ISBN: 9788425226427
On order
Delivery on Monday, 18. of November 2024
On order
Delivery on Monday, 18. of November 2024
CZK 715 -10%
Through-Silicon Vias for 3D Integration

Through-Silicon Vias for 3D Integration

Lau John
EnglishHardbackPrint on demand
McGraw-Hill Education - Europe
ISBN: 9780071785143
Print on demand
Delivery on Thursday, 21. of November 2024
Print on demand
Delivery on Thursday, 21. of November 2024
CZK 5,224 -10%
Basics Fashion Design 09: Designing Accessories

Basics Fashion Design 09: Designing Accessories

Lau, John
EnglishEbook
Bloomsbury Publishing PLC (Digital)
ISBN: 9782940439720
Available online
Available online
CZK 850 -10%
Diseño de accesorios

Diseño de accesorios

Lau, John
SpanishEbook
Editorial GG, S.L.
ISBN: 9788425226434
Available online
Available online
Designing Accessories (Basics Fashion Design)

Designing Accessories (Basics Fashion Design)

Lau, John
EnglishPaperback / softback
Bloomsbury Publishing PLC
ISBN: 9782940411313
On order
Delivery on Friday, 22. of November 2024
On order
Delivery on Friday, 22. of November 2024
CZK 650 -10%
Basics Fashion Design 09: Designing Accessories

Basics Fashion Design 09: Designing Accessories

John Lau
EnglishEbook
Bloomsbury Publishing
ISBN: 9781350241442
Available online
Available online
CZK 850 -10%
Chip On Board

Chip On Board

Lau John H.
EnglishHardback
Van Nostrand Reinhold Inc.,U.S.
ISBN: 9780442014414
On order
Delivery on Friday, 6. of December 2024
On order
Delivery on Friday, 6. of December 2024
CZK 5,851 -10%
Fan-Out Wafer-Level Packaging

Fan-Out Wafer-Level Packaging

Lau John H.
EnglishPaperback / softbackPrint on demand
Springer Verlag, Singapore
ISBN: 9789811342660
Print on demand
Delivery on Friday, 6. of December 2024
Print on demand
Delivery on Friday, 6. of December 2024
CZK 2,925 -10%
Heterogeneous Integrations

Heterogeneous Integrations

Lau John H.
EnglishHardbackPrint on demand
Springer Verlag, Singapore
ISBN: 9789811372230
Print on demand
Delivery on Friday, 6. of December 2024
Print on demand
Delivery on Friday, 6. of December 2024
CZK 4,388 -10%
Semiconductor Advanced Packaging

Semiconductor Advanced Packaging

Lau, John H.
EnglishEbook
Springer Nature Singapore
ISBN: 9789811613760
Available online
Available online
CZK 3,403 -10%
Semiconductor Advanced Packaging

Semiconductor Advanced Packaging

Lau John H.
EnglishPaperback / softbackPrint on demand
Springer Verlag, Singapore
ISBN: 9789811613784
Print on demand
Delivery on Friday, 6. of December 2024
Print on demand
Delivery on Friday, 6. of December 2024
CZK 3,218 -10%
Solder Joint Reliability

Solder Joint Reliability

Lau, John H.
EnglishEbook
Springer US
ISBN: 9781461539100
Available online
Available online
CZK 6,140 -10%
Fan-Out Wafer-Level Packaging

Fan-Out Wafer-Level Packaging

Lau, John H.
EnglishEbook
Springer Nature Singapore
ISBN: 9789811088841
Available online
Available online
CZK 3,061 -10%
Solder Joint Reliability

Solder Joint Reliability

Lau John H.
EnglishPaperback / softback
Springer-Verlag New York Inc.
ISBN: 9781461367437
On order
Delivery on Friday, 6. of December 2024
On order
Delivery on Friday, 6. of December 2024
CZK 5,851 -10%
Chiplet Design and Heterogeneous Integration Packaging

Chiplet Design and Heterogeneous Integration Packaging

Lau John H.
EnglishHardbackPrint on demand
Springer Verlag, Singapore
ISBN: 9789811999161
Print on demand
Delivery on Friday, 6. of December 2024
Print on demand
Delivery on Friday, 6. of December 2024
CZK 4,973 -10%
Handbook Of Tape Automated Bonding

Handbook Of Tape Automated Bonding

Lau John H.
EnglishHardback
Van Nostrand Reinhold Inc.,U.S.
ISBN: 9780442004279
On order
Delivery on Friday, 6. of December 2024
On order
Delivery on Friday, 6. of December 2024
CZK 5,851 -10%
Solder Joint Reliability

Solder Joint Reliability

Lau John H.
EnglishHardback
Van Nostrand Reinhold Inc.,U.S.
ISBN: 9780442002602
On order
Delivery on Friday, 6. of December 2024
On order
Delivery on Friday, 6. of December 2024
CZK 8,232 -10%
Heterogeneous Integrations

Heterogeneous Integrations

Lau, John H.
EnglishEbook
Springer Nature Singapore
ISBN: 9789811372247
Available online
Available online
CZK 4,429 -10%
Reliability of RoHS-Compliant 2D and 3D IC Interconnects

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

Lau, John H.
EnglishEbook
McGraw Hill LLC
ISBN: 9780071753807
Available online
Available online
CZK 3,652 -10%
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Lau, John H.
EnglishEbook
Springer Nature Singapore
ISBN: 9789819721405
Available online
Available online
CZK 5,113 -10%