Packaging of High Power Semiconductor Lasers

Packaging of High Power Semiconductor Lasers

AngličtinaEbook
Liu, Xingsheng
Springer New York
EAN: 9781461492634
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This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
EAN 9781461492634
ISBN 1461492637
Typ produktu Ebook
Vydavatel Springer New York
Datum vydání 14. července 2014
Jazyk English
Země United States
Autoři Liu, Hui; Liu, Xingsheng; Xiong, Lingling; Zhao, Wei
Série Micro- and Opto-Electronic Materials, Structures, and Systems