Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology

Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology

AngličtinaPevná vazbaTisk na objednávku
Wu, Yongle
Springer Verlag, Singapore
EAN: 9789819914548
Tisk na objednávku
Předpokládané dodání v pátek, 14. února 2025
3 686 Kč
Běžná cena: 4 096 Kč
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Podrobné informace

This book adopts the latest academic achievements of microwave and millimeter-wave chips based on thin-film integrated passive device technology as specific cases. Coherent processes of basic theories and design implementations of microwave and millimeter-wave chips are presented in detail. It forms a complete system from design theory, circuit simulation, full-wave electromagnetic simulation, and fabrication to measurement. Five representative microwave and millimeter-wave passive chips based on TFIPD technology are taken as examples to demonstrate the complete process from theory, design, simulation, fabrication, and measurement, which is comprehensive, systematical, and easy to learn and understand, convenient to operate, and close to the practical application. 

This book is mainly aimed at the design and simulation of microwave and millimeter-wave chips based on thin-film integrated passive device technology. On the basis of specific cases, it introduces the whole process from theory, design, simulation, optimization, fabrication to measurement of the balanced filter, microstrip filter, absorptive filter, power divider, and balun. 

This book is suitable for the professional technicians who are engaged in the design and engineering application of microwave and millimeter-wave device chips. It can also be used as the textbook of electronic science and technology, electromagnetic field and microwave technology, electronic engineering, radar engineering, integrated circuit, and other related majors in colleges and universities.



 


EAN 9789819914548
ISBN 981991454X
Typ produktu Pevná vazba
Vydavatel Springer Verlag, Singapore
Datum vydání 2. června 2023
Stránky 311
Jazyk English
Rozměry 235 x 155
Země Singapore
Autoři Wang, Weimin; Wu, Yongle
Ilustrace 7 Illustrations, color; 686 Illustrations, black and white; XV, 311 p. 693 illus., 7 illus. in color.
Edice 2023 ed.