Electronic Packaging Materials and Their Properties

Electronic Packaging Materials and Their Properties

EnglishHardbackPrint on demand
Pecht Michael
Taylor & Francis Inc
EAN: 9780849396250
Print on demand
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Detailed information

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:

interconnections
printed circuit boards
substrates
encapsulants
dielectrics
die attach materials
electrical contacts
thermal materials
solders
Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.
EAN 9780849396250
ISBN 0849396255
Binding Hardback
Publisher Taylor & Francis Inc
Publication date December 18, 1998
Pages 120
Language English
Dimensions 234 x 156
Country United States
Authors Agarwal Rakish; Dishongh Terrance J.; Javadpour Sirus; Mahajan Rahul; McCluskey F. Patrick; Pecht Michael
Illustrations 61 Tables, black and white
Series Electronic Packaging