Parallel Solution of Integral Equation-Based EM Problems in the Frequency Domain

Parallel Solution of Integral Equation-Based EM Problems in the Frequency Domain

EnglishHardback
Zhang Y.
John Wiley & Sons Inc
EAN: 9780470405451
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Detailed information

A step-by-step guide to parallelizing cem codes

The future of computational electromagnetics is changing drastically as the new generation of computer chips evolves from single-core to multi-core. The burden now falls on software programmers to revamp existing codes and add new functionality to enable computational codes to run efficiently on this new generation of multi-core CPUs. In this book, you'll learn everything you need to know to deal with multi-core advances in chip design by employing highly efficient parallel electromagnetic code. Focusing only on the Method of Moments (MoM), the book covers:

  • In-Core and Out-of-Core LU Factorization for Solving a Matrix Equation

  • A Parallel MoM Code Using RWG Basis Functions and ScaLAPACK-Based In-Core and Out-of-Core Solvers
  • A Parallel MoM Code Using Higher-Order Basis Functions and ScaLAPACK-Based In-Core and Out-of-Core Solvers
  • Turning the Performance of a Parallel Integral Equation Solver
  • Refinement of the Solution Using the Conjugate Gradient Method
  • A Parallel MoM Code Using Higher-Order Basis Functions and Plapack-Based In-Core and Out-of-Core Solvers
  • Applications of the Parallel Frequency Domain Integral Equation Solver

Appendices are provided with detailed information on the various computer platforms used for computation; a demo shows you how to compile ScaLAPACK and PLAPACK on the Windows® operating system; and a demo parallel source code is available to solve the 2D electromagnetic scattering problems.

Parallel Solution of Integral Equation-Based EM Problems in the Frequency Domain is indispensable reading for computational code designers, computational electromagnetics researchers, graduate students, and anyone working with CEM software.

EAN 9780470405451
ISBN 0470405457
Binding Hardback
Publisher John Wiley & Sons Inc
Publication date July 10, 2009
Pages 368
Language English
Dimensions 243 x 163 x 23
Country United States
Readership Professional & Scholarly
Authors Sarkar T. K.; Zhang Y.
Illustrations Drawings: 190 B&W, 0 Color; Tables: 48 B&W, 0 Color
Edition 1. Auflage
Series Wiley Series in Microwave and Optical Engineering