Effect of some Element Addition on the Mechanical of Lead Free Solder

Effect of some Element Addition on the Mechanical of Lead Free Solder

EnglishPaperback / softbackPrint on demand
Abdraboh, Azza
LAP Lambert Academic Publishing
EAN: 9783844388152
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Detailed information

This work is devoted to investigate the tensile properties of the newly developed Sn 9Zn xBi (1, and 4 wt.%) lead free solder alloys at different strain rates and temperatures to compare the results with the eutectic Sn 9Zn. also, the investigation of creep characteristics at different stresses and temperatures for selected lead-free solder alloys are presented. The microstructure and the thermal properties of these alloys were also thoroughly investigated and further, to determine the effect of Bi addition on promoting the properties of Sn Zn alloys.
EAN 9783844388152
ISBN 384438815X
Binding Paperback / softback
Publisher LAP Lambert Academic Publishing
Publication date October 20, 2011
Pages 128
Language English
Dimensions 229 x 152 x 8
Country Germany
Readership General
Authors Abdraboh, Azza
Edition Aufl.
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