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Author: John H. Lau, Lau
Heterogeneous Integrations

Heterogeneous Integrations

John H. Lau, Lau
EnglishPaperbackPrint on demand
Springer Nature B.V.
ISBN: 9789811372254
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Delivery on Wednesday, 13. of November 2024
CZK 1,235
Common price: CZK 1,372
Discount 10%
(-10%)
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Delivery on Wednesday, 13. of November 2024
CZK 1,372 -10%
Chip On Board

Chip On Board

Lau John H.
EnglishHardback
Van Nostrand Reinhold Inc.,U.S.
ISBN: 9780442014414
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Delivery on Tuesday, 19. of November 2024
CZK 5,266
Common price: CZK 5,851
Discount 10%
(-10%)
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Delivery on Tuesday, 19. of November 2024
CZK 5,851 -10%
Fan-Out Wafer-Level Packaging

Fan-Out Wafer-Level Packaging

Lau John H.
EnglishPaperback / softbackPrint on demand
Springer Verlag, Singapore
ISBN: 9789811342660
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Delivery on Tuesday, 19. of November 2024
CZK 2,633
Common price: CZK 2,925
Discount 10%
(-10%)
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Delivery on Tuesday, 19. of November 2024
CZK 2,925 -10%
Heterogeneous Integrations

Heterogeneous Integrations

Lau John H.
EnglishHardbackPrint on demand
Springer Verlag, Singapore
ISBN: 9789811372230
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Delivery on Tuesday, 19. of November 2024
CZK 3,949
Common price: CZK 4,388
Discount 10%
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CZK 4,388 -10%
Semiconductor Advanced Packaging

Semiconductor Advanced Packaging

Lau John H.
EnglishPaperback / softbackPrint on demand
Springer Verlag, Singapore
ISBN: 9789811613784
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Delivery on Tuesday, 19. of November 2024
CZK 2,896
Common price: CZK 3,218
Discount 10%
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Delivery on Tuesday, 19. of November 2024
CZK 3,218 -10%
Semiconductor Advanced Packaging

Semiconductor Advanced Packaging

Lau, John H.
EnglishEbook
Springer Nature Singapore
ISBN: 9789811613760
Available online
CZK 3,063
Common price: CZK 3,403
Discount 10%
(-10%)
Available online
CZK 3,403 -10%
Solder Joint Reliability

Solder Joint Reliability

Lau John H.
EnglishPaperback / softback
Springer-Verlag New York Inc.
ISBN: 9781461367437
On order
Delivery on Tuesday, 19. of November 2024
CZK 5,266
Common price: CZK 5,851
Discount 10%
(-10%)
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Delivery on Tuesday, 19. of November 2024
CZK 5,851 -10%
Fan-Out Wafer-Level Packaging

Fan-Out Wafer-Level Packaging

Lau, John H.
EnglishEbook
Springer Nature Singapore
ISBN: 9789811088841
Available online
CZK 2,755
Common price: CZK 3,061
Discount 10%
(-10%)
Available online
CZK 3,061 -10%
Solder Joint Reliability

Solder Joint Reliability

Lau, John H.
EnglishEbook
Springer US
ISBN: 9781461539100
Available online
CZK 5,526
Common price: CZK 6,140
Discount 10%
(-10%)
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CZK 6,140 -10%
Chiplet Design and Heterogeneous Integration Packaging

Chiplet Design and Heterogeneous Integration Packaging

Lau John H.
EnglishHardbackPrint on demand
Springer Verlag, Singapore
ISBN: 9789811999161
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Delivery on Tuesday, 19. of November 2024
CZK 4,476
Common price: CZK 4,973
Discount 10%
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Delivery on Tuesday, 19. of November 2024
CZK 4,973 -10%
Handbook Of Tape Automated Bonding

Handbook Of Tape Automated Bonding

Lau John H.
EnglishHardback
Van Nostrand Reinhold Inc.,U.S.
ISBN: 9780442004279
On order
Delivery on Tuesday, 19. of November 2024
CZK 5,266
Common price: CZK 5,851
Discount 10%
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Delivery on Tuesday, 19. of November 2024
CZK 5,851 -10%
Solder Joint Reliability

Solder Joint Reliability

Lau John H.
EnglishHardback
Van Nostrand Reinhold Inc.,U.S.
ISBN: 9780442002602
On order
Delivery on Tuesday, 19. of November 2024
CZK 7,409
Common price: CZK 8,232
Discount 10%
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CZK 8,232 -10%
Heterogeneous Integrations

Heterogeneous Integrations

Lau, John H.
EnglishEbook
Springer Nature Singapore
ISBN: 9789811372247
Available online
CZK 3,986
Common price: CZK 4,429
Discount 10%
(-10%)
Available online
CZK 4,429 -10%
Reliability of RoHS-Compliant 2D and 3D IC Interconnects

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

Lau, John H.
EnglishEbook
McGraw Hill LLC
ISBN: 9780071753807
Available online
CZK 3,287
Common price: CZK 3,652
Discount 10%
(-10%)
Available online
CZK 3,652 -10%
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Lau, John H.
EnglishEbook
Springer Nature Singapore
ISBN: 9789819721405
Available online
CZK 4,602
Common price: CZK 5,113
Discount 10%
(-10%)
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CZK 5,113 -10%
Semiconductor Advanced Packaging

Semiconductor Advanced Packaging

Lau John H.
EnglishHardbackPrint on demand
Springer Verlag, Singapore
ISBN: 9789811613753
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Delivery on Tuesday, 19. of November 2024
CZK 4,213
Common price: CZK 4,681
Discount 10%
(-10%)
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Delivery on Tuesday, 19. of November 2024
CZK 4,681 -10%
Fan-Out Wafer-Level Packaging

Fan-Out Wafer-Level Packaging

Lau John H.
EnglishHardbackPrint on demand
Springer Verlag, Singapore
ISBN: 9789811088834
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Delivery on Tuesday, 19. of November 2024
CZK 3,686
Common price: CZK 4,096
Discount 10%
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Delivery on Tuesday, 19. of November 2024
CZK 4,096 -10%
Through-Silicon Vias for 3D Integration

Through-Silicon Vias for 3D Integration

Lau, John H.
EnglishEbook
McGraw Hill LLC
ISBN: 9780071785150
Available online
CZK 3,647
Common price: CZK 4,052
Discount 10%
(-10%)
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CZK 4,052 -10%
3D IC Integration and Packaging

3D IC Integration and Packaging

Lau, John H.
EnglishEbook
McGraw Hill LLC
ISBN: 9780071848077
Available online
CZK 4,907
Common price: CZK 5,452
Discount 10%
(-10%)
Available online
CZK 5,452 -10%
Chiplet Design and Heterogeneous Integration Packaging

Chiplet Design and Heterogeneous Integration Packaging

Lau, John H.
EnglishEbook
Springer Nature Singapore
ISBN: 9789811999178
Available online
CZK 4,602
Common price: CZK 5,113
Discount 10%
(-10%)
Available online
CZK 5,113 -10%
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Lau John H.
EnglishHardbackPrint on demand
Springer Verlag, Singapore
ISBN: 9789819721399
In stock 1 pc
Delivery on Wednesday, 9. of October 2024
CZK 2,871
Common price: CZK 4,101
Discount 30%
(-30%)
In stock 1 pc
Delivery on Wednesday, 9. of October 2024
CZK 4,101 -30%
Chiplet Design and Heterogeneous Integration Packaging

Chiplet Design and Heterogeneous Integration Packaging

Lau John H.
EnglishPaperback / softbackPrint on demand
Springer Verlag, Singapore
ISBN: 9789811999192
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Delivery on Tuesday, 19. of November 2024
CZK 3,159
Common price: CZK 3,510
Discount 10%
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Delivery on Tuesday, 19. of November 2024
CZK 3,510 -10%
Assembly and Reliability of Lead-Free Solder Joints

Assembly and Reliability of Lead-Free Solder Joints

Lau, John H.
EnglishEbook
Springer Nature Singapore
ISBN: 9789811539206
Available online
CZK 3,063
Common price: CZK 3,403
Discount 10%
(-10%)
Available online
CZK 3,403 -10%
Assembly and Reliability of Lead-Free Solder Joints

Assembly and Reliability of Lead-Free Solder Joints

Lau John H.
EnglishHardbackPrint on demand
Springer Verlag, Singapore
ISBN: 9789811539190
Print on demand
Delivery on Tuesday, 19. of November 2024
CZK 4,213
Common price: CZK 4,681
Discount 10%
(-10%)
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Delivery on Tuesday, 19. of November 2024
CZK 4,681 -10%