Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

EnglishHardbackPrint on demand
Lau John H.
Springer Verlag, Singapore
EAN: 9789819721399
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Delivery on Tuesday, 25. of February 2025
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Detailed information

This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets and heterogeneous integration packaging, and on-board optics, near-package optics, and co-packaged optics.

The book benefits researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc.

EAN 9789819721399
ISBN 9819721393
Binding Hardback
Publisher Springer Verlag, Singapore
Publication date May 24, 2024
Pages 501
Language English
Dimensions 235 x 155
Country Singapore
Authors Lau John H.
Illustrations 520 Illustrations, color; 36 Illustrations, black and white; XX, 501 p. 556 illus., 520 illus. in color.
Manufacturer information
The manufacturer's contact information is currently not available online, we are working intensively on the axle. If you need information, write us on helpdesk@megabooks.sk, we will be happy to provide it.

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