Search Results

Author: Lau, John
Fan-Out Wafer-Level Packaging

Fan-Out Wafer-Level Packaging

Lau John H.
EnglishHardbackPrint on demand
Springer Verlag, Singapore
ISBN: 9789811088834
Print on demand
Delivery on Monday, 3. of February 2025
Print on demand
Delivery on Monday, 3. of February 2025
CZK 4,096 -10%
Through-Silicon Vias for 3D Integration

Through-Silicon Vias for 3D Integration

Lau, John H.
EnglishEbook
McGraw Hill LLC
ISBN: 9780071785150
Available online
Available online
CZK 4,052 -10%
3D IC Integration and Packaging

3D IC Integration and Packaging

Lau, John H.
EnglishEbook
McGraw Hill LLC
ISBN: 9780071848077
Available online
Available online
CZK 5,452 -10%
Strategies for a Successful Retirement: Before, During, & After

Strategies for a Successful Retirement: Before, During, & After

Lau, John Jr.
EnglishEbook
Ebookit.com
ISBN: 9781456608125
Available online
Available online
CZK 150 -10%
Semiconductor Advanced Packaging

Semiconductor Advanced Packaging

Lau John H.
EnglishHardbackPrint on demand
Springer Verlag, Singapore
ISBN: 9789811613753
Print on demand
Delivery on Monday, 3. of February 2025
Print on demand
Delivery on Monday, 3. of February 2025
CZK 4,681 -10%
Chiplet Design and Heterogeneous Integration Packaging

Chiplet Design and Heterogeneous Integration Packaging

Lau, John H.
EnglishEbook
Springer Nature Singapore
ISBN: 9789811999178
Available online
Available online
CZK 5,113 -10%
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Lau John H.
EnglishHardbackPrint on demand
Springer Verlag, Singapore
ISBN: 9789819721399
In stock 1 pc
Delivery on Tuesday, 17. of December 2024
In stock 1 pc
Delivery on Tuesday, 17. of December 2024
CZK 4,101 -30%
Chiplet Design and Heterogeneous Integration Packaging

Chiplet Design and Heterogeneous Integration Packaging

Lau John H.
EnglishPaperback / softbackPrint on demand
Springer Verlag, Singapore
ISBN: 9789811999192
Print on demand
Delivery on Monday, 3. of February 2025
Print on demand
Delivery on Monday, 3. of February 2025
CZK 3,510 -10%
Race Between Time and Money: Strategies for a Successful Retirement

Race Between Time and Money: Strategies for a Successful Retirement

John Lau CFP(R), Lau CFP(R)
EnglishEbook
Lulu Publishing Services
ISBN: 9781684702541
Available online
Available online
CZK 156 -10%
Hydrology of the Hawaiian Islands

Hydrology of the Hawaiian Islands

Lau L.Stephen
EnglishPaperback / softback
University of Hawai'i Press
ISBN: 9780824829483
On order
Delivery on Tuesday, 14. of January 2025
On order
Delivery on Tuesday, 14. of January 2025
CZK 2,094 -10%
Race Between Time and Money

Race Between Time and Money

Lau Cfp(r), John
EnglishPaperback / softback
Lulu Publishing Services
ISBN: 9781684702558
On order
Delivery on Tuesday, 14. of January 2025
On order
Delivery on Tuesday, 14. of January 2025
CZK 450 -10%
Assembly and Reliability of Lead-Free Solder Joints

Assembly and Reliability of Lead-Free Solder Joints

Lau, John H.
EnglishEbook
Springer Nature Singapore
ISBN: 9789811539206
Available online
Available online
CZK 3,403 -10%
Microvias: For Low Cost, High Density Interconnects

Microvias: For Low Cost, High Density Interconnects

Lau, John H.
EnglishEbook
McGraw Hill LLC
ISBN: 9780071382991
Available online
Available online
CZK 2,500 -10%
Assembly and Reliability of Lead-Free Solder Joints

Assembly and Reliability of Lead-Free Solder Joints

Lau John H.
EnglishPaperback / softbackPrint on demand
Springer Verlag, Singapore
ISBN: 9789811539220
Print on demand
Delivery on Monday, 3. of February 2025
Print on demand
Delivery on Monday, 3. of February 2025
CZK 3,364 -10%
Assembly and Reliability of Lead-Free Solder Joints

Assembly and Reliability of Lead-Free Solder Joints

Lau John H.
EnglishHardbackPrint on demand
Springer Verlag, Singapore
ISBN: 9789811539190
Print on demand
Delivery on Monday, 3. of February 2025
Print on demand
Delivery on Monday, 3. of February 2025
CZK 4,681 -10%
Advanced MEMS Packaging

Advanced MEMS Packaging

Lau John
EnglishHardback
McGraw-Hill Education - Europe
ISBN: 9780071626231
Available at distributor
Delivery on Friday, 17. of January 2025
Available at distributor
Delivery on Friday, 17. of January 2025
CZK 3,796 -10%
Electronics Manufacturing

Electronics Manufacturing

Lau John
EnglishHardback
McGraw-Hill Education - Europe
ISBN: 9780071386241
Available at distributor
Delivery on Friday, 17. of January 2025
Available at distributor
Delivery on Friday, 17. of January 2025
CZK 3,796 -10%
Ultra-high Frequency Linear Fiber Optic Systems

Ultra-high Frequency Linear Fiber Optic Systems

Lau Kam Y.
EnglishHardback
Springer, Berlin
ISBN: 9783540253501
On order
Delivery on Monday, 3. of February 2025
On order
Delivery on Monday, 3. of February 2025
CZK 2,339 -10%
Advanced MEMS Packaging

Advanced MEMS Packaging

Lau, John H.
EnglishEbook
McGraw Hill LLC
ISBN: 9780071627924
Available online
Available online
CZK 4,477 -10%
Electronics Manufacturing

Electronics Manufacturing

Lau, John H.
EnglishEbook
McGraw Hill LLC
ISBN: 9780071500876
Available online
Available online
CZK 3,752 -10%
Mechanics of Solder Alloy Interconnects

Mechanics of Solder Alloy Interconnects

Frear, Darrel R.
EnglishHardback
Van Nostrand Reinhold Inc.,U.S.
ISBN: 9780442015053
On order
Delivery on Monday, 3. of February 2025
On order
Delivery on Monday, 3. of February 2025
CZK 5,851 -10%