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Author: Lau, John H.
Heterogeneous Integrations

Heterogeneous Integrations

John H. Lau, Lau
EnglishPaperbackPrint on demand
Springer Nature B.V.
ISBN: 9789811372254
Print on demand
Delivery on Tuesday, 21. of January 2025
Print on demand
Delivery on Tuesday, 21. of January 2025
CZK 1,372 -10%
Chip On Board

Chip On Board

Lau John H.
EnglishHardback
Van Nostrand Reinhold Inc.,U.S.
ISBN: 9780442014414
On order
Delivery on Monday, 27. of January 2025
On order
Delivery on Monday, 27. of January 2025
CZK 5,851 -10%
Fan-Out Wafer-Level Packaging

Fan-Out Wafer-Level Packaging

Lau John H.
EnglishPaperback / softbackPrint on demand
Springer Verlag, Singapore
ISBN: 9789811342660
Print on demand
Delivery on Monday, 27. of January 2025
Print on demand
Delivery on Monday, 27. of January 2025
CZK 2,925 -10%
Heterogeneous Integrations

Heterogeneous Integrations

Lau John H.
EnglishHardbackPrint on demand
Springer Verlag, Singapore
ISBN: 9789811372230
Print on demand
Delivery on Monday, 27. of January 2025
Print on demand
Delivery on Monday, 27. of January 2025
CZK 4,388 -10%
Semiconductor Advanced Packaging

Semiconductor Advanced Packaging

Lau John H.
EnglishPaperback / softbackPrint on demand
Springer Verlag, Singapore
ISBN: 9789811613784
Print on demand
Delivery on Monday, 27. of January 2025
Print on demand
Delivery on Monday, 27. of January 2025
CZK 3,218 -10%
Semiconductor Advanced Packaging

Semiconductor Advanced Packaging

Lau, John H.
EnglishEbook
Springer Nature Singapore
ISBN: 9789811613760
Available online
Available online
CZK 3,403 -10%
Solder Joint Reliability

Solder Joint Reliability

Lau, John H.
EnglishEbook
Springer US
ISBN: 9781461539100
Available online
Available online
CZK 6,140 -10%
Solder Joint Reliability

Solder Joint Reliability

Lau John H.
EnglishPaperback / softback
Springer-Verlag New York Inc.
ISBN: 9781461367437
On order
Delivery on Monday, 27. of January 2025
On order
Delivery on Monday, 27. of January 2025
CZK 5,851 -10%
Fan-Out Wafer-Level Packaging

Fan-Out Wafer-Level Packaging

Lau, John H.
EnglishEbook
Springer Nature Singapore
ISBN: 9789811088841
Available online
Available online
CZK 3,061 -10%
Chiplet Design and Heterogeneous Integration Packaging

Chiplet Design and Heterogeneous Integration Packaging

Lau John H.
EnglishHardbackPrint on demand
Springer Verlag, Singapore
ISBN: 9789811999161
Print on demand
Delivery on Monday, 27. of January 2025
Print on demand
Delivery on Monday, 27. of January 2025
CZK 4,973 -10%
Handbook Of Tape Automated Bonding

Handbook Of Tape Automated Bonding

Lau John H.
EnglishHardback
Van Nostrand Reinhold Inc.,U.S.
ISBN: 9780442004279
On order
Delivery on Monday, 27. of January 2025
On order
Delivery on Monday, 27. of January 2025
CZK 5,851 -10%
Solder Joint Reliability

Solder Joint Reliability

Lau John H.
EnglishHardback
Van Nostrand Reinhold Inc.,U.S.
ISBN: 9780442002602
On order
Delivery on Monday, 27. of January 2025
On order
Delivery on Monday, 27. of January 2025
CZK 8,232 -10%
Heterogeneous Integrations

Heterogeneous Integrations

Lau, John H.
EnglishEbook
Springer Nature Singapore
ISBN: 9789811372247
Available online
Available online
CZK 4,429 -10%
Reliability of RoHS-Compliant 2D and 3D IC Interconnects

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

Lau, John H.
EnglishEbook
McGraw Hill LLC
ISBN: 9780071753807
Available online
Available online
CZK 3,652 -10%
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Lau, John H.
EnglishEbook
Springer Nature Singapore
ISBN: 9789819721405
Available online
Available online
CZK 5,113 -10%
Fan-Out Wafer-Level Packaging

Fan-Out Wafer-Level Packaging

Lau John H.
EnglishHardbackPrint on demand
Springer Verlag, Singapore
ISBN: 9789811088834
Print on demand
Delivery on Monday, 27. of January 2025
Print on demand
Delivery on Monday, 27. of January 2025
CZK 4,096 -10%
3D IC Integration and Packaging

3D IC Integration and Packaging

Lau, John H.
EnglishEbook
McGraw Hill LLC
ISBN: 9780071848077
Available online
Available online
CZK 5,452 -10%
Through-Silicon Vias for 3D Integration

Through-Silicon Vias for 3D Integration

Lau, John H.
EnglishEbook
McGraw Hill LLC
ISBN: 9780071785150
Available online
Available online
CZK 4,052 -10%
Semiconductor Advanced Packaging

Semiconductor Advanced Packaging

Lau John H.
EnglishHardbackPrint on demand
Springer Verlag, Singapore
ISBN: 9789811613753
Print on demand
Delivery on Monday, 27. of January 2025
Print on demand
Delivery on Monday, 27. of January 2025
CZK 4,681 -10%
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Lau John H.
EnglishHardbackPrint on demand
Springer Verlag, Singapore
ISBN: 9789819721399
In stock 1 pc
Delivery on Monday, 9. of December 2024
In stock 1 pc
Delivery on Monday, 9. of December 2024
CZK 4,101 -30%
Chiplet Design and Heterogeneous Integration Packaging

Chiplet Design and Heterogeneous Integration Packaging

Lau John H.
EnglishPaperback / softbackPrint on demand
Springer Verlag, Singapore
ISBN: 9789811999192
Print on demand
Delivery on Monday, 27. of January 2025
Print on demand
Delivery on Monday, 27. of January 2025
CZK 3,510 -10%
Chiplet Design and Heterogeneous Integration Packaging

Chiplet Design and Heterogeneous Integration Packaging

Lau, John H.
EnglishEbook
Springer Nature Singapore
ISBN: 9789811999178
Available online
Available online
CZK 5,113 -10%
Assembly and Reliability of Lead-Free Solder Joints

Assembly and Reliability of Lead-Free Solder Joints

Lau, John H.
EnglishEbook
Springer Nature Singapore
ISBN: 9789811539206
Available online
Available online
CZK 3,403 -10%
Assembly and Reliability of Lead-Free Solder Joints

Assembly and Reliability of Lead-Free Solder Joints

Lau John H.
EnglishHardbackPrint on demand
Springer Verlag, Singapore
ISBN: 9789811539190
Print on demand
Delivery on Monday, 27. of January 2025
Print on demand
Delivery on Monday, 27. of January 2025
CZK 4,681 -10%